Thermal interface material is used to transfer heat between two objects. This material will remove air gaps and provide a more efficient transfer of heat.

Thermal Interface Selection Guide

Gap Filler Pad GP

Gap Filler Pad GP, gap pad
The GP series is a ceramic particle filled silicone rubber based filler with 1.2 – 11W/m-K thermal conductivity.

Gap Filler Pad GP Series

Typical PropertiesGP1000GP2000GP3000GP5000GP7000GP8000 GPE000
FormThermal Conductive Gap Filler PadThermal Conductive Gap Filler PadThermal Conductive Gap Filler PadThermal Conductive Gap Filler PadThermal Conductive Gap Filler PadThermal Conductive Gap Filler PadThermal Conductive Gap Filler Pad
ColorLight GrayBlueGrayLight BlueCyanLight GrayLight Gray
Thickness Range0.13 - 10mm0.13 - 10mm0.13 - 10mm0.13 - 10mm0.25 - 10mm0.25 - 10mm0.25 - 10mm
Specific Gravity2.00 g/cm 32.20 g/cm 32.60 g/cm 32.90 g/cm 33.00 g/cm 32.50 g/cm 32.45 g/cm 3
Thermal Conductivity1.0 W/m-K1.5 W/m-K2.0 W/m-K3.0 W/m-K5.0 W/m-K7.8 W/m-K11.0 W/m-K
Multilayer Capable0.5mm up0.5mm up0.5mm up0.5mm up0.5mm up0.5mm up0.5mm up
Insulation PropertiesHighHighHighHighHighLowLow
Flammability RatingUL 94V-0UL 94V-0UL 94V-0UL 94V-0UL 94V-0UL 94V-0UL 94V-0
Continuous Working Temperature -55 to 200°c -55 to 200°c -55 to 200°c -55 to 200°c -55 to 200°c -55 to 200°c -55 to 200°c
Hardness Options
Standard (H1)46 Shore OO46 Shore OO46 Shore OO46 Shore OO46 Shore OO46 Shore OO46 Shore OO
Ultrasoft (H0)N/A36 Shore OO36 Shore OO36 Shore OO36 Shore OO36 Shore OO36 Shore OO
Ubersoft (HU)N/A26 Shore OO26 Shore OO26 Shore OO26 Shore OO26 Shore OO26 Shore OO

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Conductive Dispensable Jelly

Conductive Dispensable Jelly, gel

The thermal jelly material is a thermally conductive particle filled silicone jelly with high conformability and thermal conductive properties. It is a pre-cured, auto dispensable thermal interface material designed to replace conventional thermal conductive gap filler pads. This jelly does not require mixing and curing, auto-dispensing process can reduce the assembly time and cost, which make the design more flexible.With ultra soft properties, this jelly can easily deflect under very low compression face and will fill voids and even surfaces. This material will also wet out matting surfaces in order to efficiently transfer heat from components to the heat sink.

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Insulation Pad GPi

Insulation Pad GPi
GP-IPXXXX is a thermal conductive insulator pad with fiberglass-reinforced material.

Insulation Pad GPi Series

Typical PropertiesGP-IP1000GP-IP1500GP-IP2800GP-IP3800GP-IP5000
FormThermal Conductive Electrical Insulator PadThermal Conductive Electrical Insulator PadThermal Conductive Electrical Insulator PadThermal Conductive Electrical Insulator PadThermal Conductive Electrical Insulator Pad
ColorBlueGrayLight BlueMagentaCyan
Thickness Range0.25,0.35,0.50mm0.25,0.35,0.50mm0.25,0.35,0.50mm0.25,0.35,0.50mm0.25,0.35,0.50mm
Specific Gravity2.20 g/cm 32.80 g/cm 32.90 g/cm 32.85 g/cm 33.05 g/cm 3
Thermal Conductivity1.0 W/m-K1.5 W/m-K2.8 W/m-K3.8 W/m-K5.0 W/m-K
Multilayer CapableN/AN/AN/AN/AN/A
Insulation PropertiesSuperiorSuperiorSuperiorSuperiorSuperior
Flammability RatingUL 94V-0UL 94V-0UL 94V-0UL 94V-0UL 94V-0
Continuous Working Temperature -55 to 200°C -55 to 200°C -55 to 200°C -55 to 200°C -55 to 200°C
Hardness OptionsN/AN/AN/AN/AN/A
Standard (H1)70 Shore A70 Shore A70 Shore A70 Shore A70 Shore A
Ultrasoft (H0)N/AN/AN/AN/AN/A
Ubersoft (HU)N/AN/AN/AN/AN/A

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Conductive Pad CP

Conductive Pad CP
CPXXXX is an advanced thermally and electrically conductive pad.

Conductive Pad CP Series

Typical PropertiesGP-CP5000
FormThermal & Electrical Conductive Pad
ColorLight Grey
Thickness0.15, 0.25, 0.50, 0.75, 1.00mm
Density2.54 g/cm^3
Thermal connectivity1.5 W/m-K
Multi-layer Capablen/a
Electric Insulationconductive, DC Through
Resistance <0.5 ohm
Flammability RatingUL 94V-0
Operating Temp. Range (Celsius)-55 - 200
Hardness Selection
Standard (H1)25 Shore A
Ultrasoft (H0)n/a
Ubersoft (HU)n/a

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Multilayer Thermal Pads

Multilayer Thermal Pads

Multi-layer forming provides flexible solutions for the most complex thermal management requirements. This process combines similar types of silicone material with various hardness levels, adhesion and rebound forces; allowing for multi-layered physical properties while maintaining consistent thermal performance. 

Multi-layer technology provides an excellent option that will reduce cost, but not performance. It is suitable for all thermal pad applications greater than 0.5mm and provides an ideal solution for Ultrasoft and high tensile strength applications.