Thermal Pad GP2000 Series

Thermal Pad GP2000 Series
Description:The GP2000 series is a ceramic particle filled silicone rubber based filler with 1.2W/m-K thermal conductivity. This product provides a good balance between thermal performance and competitive pricing. It is used between heat sink and heat generating
components. The Ultra soft version will fill voids and rugged surfaces, while wetting out matting surfaces in order to efficiently transfer heat from components to heat sink.


  • General Thermal conductivity at a competitive price
  • Ü bersoft and Ultrasoft are highly compressible
  • Provides good wetting
  • Self-tacky or additional PSA available
  • Convenient packaging

Technical Information