Conductive Form-In-Place Gasket
Description: The F5305 is a highly compressible Form-in-Place gasket. With extremely high conductivity, this material provides superior shielding effectiveness at a much softer compression level.
This material is preferable for large metal housings with extensive tolerance variations.
The F5305 is designed for large profile applications, (e.g. bead size from 0.9mm (0.035”) to 3.0mm (0.120”) on metal substrates).
- Extremely High Conductivity in the Ni/Gr filled FIP line
- A highly compressible soft gasket designed for low compression force applications
- More than 100 dB shielding effectiveness from 200 MHz to 10GHz with a small gasket bead
- More than 80 Newtons/cm2 shear adhesion on common housing substrates and coatings