Description:The conductive Form-In-Place material F5301 contains high mechanical strength, excellent adhesion and is ideal for a small gasket profile requirement. This material is suitable for metal or glass fabric filled plastic substrates. The F5301 offers enhanced galvanic corrosion resistance and stability in severe environments.

Benefits:

• Extremely small gasket profile in Ni/Gr filled FIP line
• More than 100 dB shielding effectiveness from 200 MHz to 10GHz with a small gasket bead
• Accuracy for gasket location within 0.001″ (0.025 mm)
• More than 100 Newtons/cm² shear adhesion on common housing substrates and coatings